Web• UL94, V0 • J-STD-020 MSL level 1 • J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 solderable matte tin plated leads • JESD-201 class 2 whisker test • IPC7531 footprint • JEDEC registered package outline • IEC 61000-4-4 level 4: – 4 kV • ISO10605, IEC 61000-4-2, C= 150 pF - R = 330 Ω exceeds level 4: – 30 kV (air discharge) – 30 kV … WebMIL-STD-750,method 2026. - Mounting position: Any REV:A QW-G7079 Features - Working voltage: 5.0 V - Low leakage current. - Low capacitance: 0.15 pF typical (I/O to GND) ... Standard Packaging Case Type Qty Per Reel (Pcs) DFN10P 3,000 Reel Size (inch) 7. Title: 圖形1 Author: Comchip-Angel
MIL-STD-750D, Test Methods for Semiconductor Devices
WebMIL–STD–750–2 – Mechanical Test Methods For Semiconductor Devices. MIL–STD–750–3 – Electrical Characteristics Tests for Bipolar, MOSFET, and Gallium … Web• J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 solderable matte tin plated leads • JESD-201 class 2 whisker test • IPC7531 footprint • JEDEC registered package outline ... discharges according to IEC 61000-4-2 and MIL STD 883, method 3015, and electrical overstress according to IEC 61000-4-4 and 5. This device is more generally brotherhood of shadow solomon\u0027s revenge
MIL-STD-750 Test Methods for Semiconductor Devices
Web6 apr. 2024 · Complies with the following standards • UL94, V0 • J-STD-020 MSL level 1 • J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026 • JESD-201 class 2 whisker test • UL 497B file number: QVGQ2.E136224 • IEC 61000-4-4 level 4: – 4 k V • IEC 61000-4-2, C = 150 pF, R = 330 Ω exceeds level 4: – 30 kV (air discharge) – 30 kV (contact … http://everyspec.com/FSC-CODE/5961/ WebStandard Avalanche Sinterglass Diode DESIGN SUPPORT TOOLS MECHANICAL DATA Case: SOD-57 Terminals: plated axial leads, sold erable per MIL-STD-750, method 2026 Polarity: color band denotes cathode end Mounting position: any Weight: approx. 369 mg FEATURES • Glass passivated junction • Hermetically sealed axial-leaded glass envelope cargo homme rose